Institution of Engineering and Technology

The IET is a world leading professional organisation sharing and advancing knowledge to promote science, engineering and technology across the world.

Fabrication of void-free copper filled through-glass-via for wafer-level RF MEMS packaging
Lee,J.Y. et al.
Electronics Letters(2012),48(17):1076

This article is available from multiple sources. Please click on the logo of the service to which you have a subscription, or click any logo to obtain pay-per-view access.

IET Digital Library on Scitation
  Access the IET Digital Library

IEL on IEEE Xplore
  Access the IEL (IEEE/IET Electronic Library) on IEEE Xplore®