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Fabrication Technologies of Field Emitter Arrays

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Abstract

Total internal reflection (TIR) holographic lithography is studied as a new method for field emitter array (FEA) fabrication. Four basic parameters of the process - scan speed, laser power, focus distance and step distance, are analyzed to optimize the hole patterns. In addition, the characteristics of the Aluminum (Al) parting layer are studied to minimize the stress produced by Molybdenum (Mo) layer during Spindt-type tip formation process.

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Acknowledgement

The authors would like to thank S.Gray, F.Clube, B.Legratiet of Holtronic Technologies S.A. for fruitful discussion.

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Correspondence to J. H. Choi.

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Choi, J.H., Ryu, Y.S., Kang, J.H. et al. Fabrication Technologies of Field Emitter Arrays. MRS Online Proceedings Library 471, 211–216 (1997). https://doi.org/10.1557/PROC-471-211

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  • DOI: https://doi.org/10.1557/PROC-471-211

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