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Temperature Dependence of Bolometric and Non-Bolometric Photoresponse of a Structured YBa2Cu3O7−δ Thin Film

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Phonon Scattering in Condensed Matter VII

Part of the book series: Springer Series in Solid-State Sciences ((SSSOL,volume 112))

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Abstract

We investigated the temperature dependence of the transient voltage photoresponse of a current biased structured YBa2Cu3O7−δ thin film in its transition temperature region, around 79 K. Both, picosecond nonbolometric and nanosecond bolometric response to ultrashort far-infrared laser pulses were found for frequencies between 25 cm−1 and 215 cm−1. We will discuss optimum conditions for radiation detection and present an analysis of the dynamical behaviour of excited high T c thin films.

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References

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Authors and Affiliations

  1. Institut für Angewandte Physik III, University of Regensburg, Universitätsstr. 31, W-8400, Regensburg, Fed. Rep. of Germany

    M. A. Heusinger, R. S. Nebosis, W. Schatz & K. F. Renk

  2. Moscow State Pedagogical University, 119435, Moscow, Russia

    G. N. Gol’tsman, B. S. Karasik, A. D. Semenov & G. M. Gershenzon

Authors
  1. M. A. Heusinger
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  2. R. S. Nebosis
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  3. W. Schatz
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  4. K. F. Renk
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  5. G. N. Gol’tsman
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  6. B. S. Karasik
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  7. A. D. Semenov
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  8. G. M. Gershenzon
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Editor information

Editors and Affiliations

  1. Hahn-Meitner Institute, Glienicker Strasse 100, W-1000, Berlin 39, Germany

    Michael Meissner

  2. Department of Physics, Cornell University, 14853-2501, Ithaca, NY, USA

    Robert O. Pohl

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© 1993 Springer-Verlag Berlin Heidelberg

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Heusinger, M.A. et al. (1993). Temperature Dependence of Bolometric and Non-Bolometric Photoresponse of a Structured YBa2Cu3O7−δ Thin Film. In: Meissner, M., Pohl, R.O. (eds) Phonon Scattering in Condensed Matter VII. Springer Series in Solid-State Sciences, vol 112. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-84888-9_76

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  • DOI: https://doi.org/10.1007/978-3-642-84888-9_76

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-84890-2

  • Online ISBN: 978-3-642-84888-9

  • eBook Packages: Springer Book Archive

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